Date of Award
Honors College Theses
Dr. Joyce W. O'Rourke
Dr. Beverly Wade
This paper gives a brief overview of the process of completely sealing and permanently joining glass to a semi-conductor without the use of adhesives known as anodic or electrostatic bonding. It is well known that this process will introduce thermal strain due to different coefficients of thermal expansion between any metal or semiconductor and glass. This paper will also describe the effect of the MEMS packaging process on various devices that are bonded electrostatically.
Iyasere, Sonya G., "Analysis of the anodic bonding process and the packaging effects in MEMS devices" (2000). Electronic Dissertations and Theses. 37.